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                Automatic Laser Edge Isolation

                [Time:2012-03-16 Browsing times:2823]

                Laser Edge Isolation


                    plication: Laser edge isolation by laser grooving.

                    Wafer size: 125mm×125mm/156mm×156mm
                    High throughput of up to1,500 wafer/h
                    CCD vision system for automatic alignment;
                    Low breakage rates
                    Available as inline or stand-alone system


                For more details, please contact; 86-27-87922379.